Laboratory of ceramic materials

Research directions

• Development of research in the field of ceramic materials and components for electrical engineering:
  • aluminous and zirconia ceramic  materials for insulators;
  • cordierite ceramic material  for catalysts and filter elements;
  • steatite ceramic  material for insulators;
  • piezoelectric  materials for piezomotors;
  • multifferoic materials for magnetoelectric sensors in optoelectronics and electronics, for microwave transducers;

• Development of research in the field of ceramic materials and components for energy
  • advanced ceramics for SOFC (electrolyte and electrodes;)
  • ceramic microspheres for heat insulating materials;

• Development of research in the field of ceramic materials for the decontamination / purification of polluting waters
• powders / microspheres – calcium phosphate based ceramic (HAP and HAP / TCP composites);
• ceramic filters;

• Development of research in the field of biomaterial ceramics
  • biocompatible ceramic materials (β-TCP, HAP and HAP/TCP composites) for medical applications – orthopedic and maxilo-facial surgery, bone reconstruction (ceramic microspheres and 3D structures);

Development of research in ceramic materials for space, security, defense

• non-oxide ceramic based on SiC;
• composite ceramics based on AlN-SiC, SiC-Si3N4.

SERVICES

• Characterization and testing of ceramic materials, components and products;
• Market research for companies to identify innovation niches;
• Market studies at the request of companies for launching new products, technologies on the market

TECHNOLOGIES

• Conventional and unconventional technologies for obtaining ceramic powders;
• Molding of products by uniaxial pressing, pressing under hot pressure, pressing by SPS technique

Laboratory Infrastructure

Equipment for obtaining materials

• Rotary mill of 5…50 l;
• Planetary and  Attritor mill;
• Press-filter FRIRZCH;
• Extruder DORST;
• Autoclave, T=250oC, 60 bar.

Equipment for shaping

• DORST extruder;
• Hydraulic presses 10 … 200 tf;
• Hot Injection Molding;
• Lapping machine;
• Equipment for vacuum processing of thin  layers  – BESTEC.

Equipment for sintering

• Furnaces:  C– T= 1200 ÷ 1350 0C;
• Furnace (air / argon / nitrogen) LENTON , T = 1600 0C;
• Spark plasma sintering plant- SPS – T= 2200 0C.